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PAC TECH - Packaging Technologies is a worldwide leader in both Wafer Level Bumping & Packaging Services and in
Advanced Packaging Equipment Manufacturing.
PAC TECH has over 15 years of experience in the industry and has manufacturing sites all around the world, including: Germany, United States, Japan, and Malaysia. These sites can supply both engineering and prototyping services, as well as high volume production.
PAC TECH is structured to provide a single source for all contract bumping services, as well as providing turn key advanced packaging equipment.
The core technologies that PAC TECH offers are centered around Electroless Nickel/Gold Bumping and Laser Based Solder Deposition
(services and equipment).
PAC TECH's philosophy is to integrate its leading technology developments into high quality equipment for high volume production.
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