Pac Tech is the Worldwide Leading Supplier in ELECTROLESS WAFER BUMPING technology. With its volume production facilities in Germany, USA and Japan it offers a capacity of over 760 000 Wafer per year in 6”, 8” and 12”. Pac Tech provides turn key Wafer bumping and Wafer level packaging solutions. This includes engineering, development of prototypes and high volume production.
Pac Tech offers following technologies for Wafer Level Packaging: E-less Ni/Au Bumping (4,5,6,8,12 inch)
E-less Ni/Au² or Ni/Pd/Au for TS Wirebond
Copper Pad Metallization
Wafer Level Printing (eut.SnPb, SnAgCu)
Micro Solder Ball Attach
Solder Ball SB2-Jet (eut.SnPb, SnAgCu, AuSn, InSn)
Wafer Level RDL & CSP , BCB Repassivation
Wafer Thinning & Dicing, Backside Laser Marking
Die Singulation & Reel Packaging, Flip Chip Assembly | Pac Tech philosophy is to integrate its leading technology developments in to volume production equipment. Pac Tech provides three equipment platforms: ELECTROLESS WAFER BUMPING and Peripheral Equipment:
PACLINE 300, PlasPac, SpinPac,
V-Pac, MegaPac
Laser Assisted Solder Jetting and Die/Wafer Level Attach for Flip Chip and MEMS Packaging:
SB² Jet, LAPLACE-FC, LAPLACE-WLP, Laser Marking LS²
Wafer Level µSolder Ball Attach, Ball Inspection and Ball Rework:
ultra SB², Bump AOI HS³ |
