PAC TECH - Packaging Technologies is a worldwide leader in both Wafer Level Bumping & Packaging Services and in 
Advanced Packaging Equipment Manufacturing.

PAC TECH has over 15 years of experience in the industry and has manufacturing sites all around the world, including: Germany, United States, Japan, and Malaysia.  These sites can supply both engineering and  prototyping services, as well as high volume production.

PAC TECH is structured to provide a single source for all contract bumping services, as well as providing turn key advanced packaging equipment.

The core technologies that PAC TECH offers are centered around Electroless Nickel/Gold Bumping and Laser Based Solder Deposition 
(services and equipment).

PAC TECH's philosophy is to integrate its leading technology developments into high quality equipment for high volume production.