LAPLACE-Can

High Accuracy Automatic Laser Bonder for Wafer Probe Cards

Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability

LAPLACE-Can (Product Brochure Download /.pdf 1MB)

Highlights
  • Placement accuracy: +/- ≤ 5µm
  • Probe card sizes up to 13 inch
  • Full process control
  • Alignment control by position bonding
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Options
Benefits
Technical Specifications