LAPLACE-Cap

High Accuracy Automatic Laser Bonder for Capacitor Bonding

Capacitor Bonding and Laser Reflow for High Density Applications with Very Fine Component to Component Distances on Special Substrates like e.g. Wafer Probe Cards

LAPLACE-Cap (Product Brochure Download /.pdf 2MB)

Highlights
  • Placement accuracy: +/- ≤ 25µm
  • Throughput: 500 capacitors per hour (including soldering)
  • No additional reflow process needed
  • Requires only a thin layer of solder on the substrate/component pad

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Technical Specifications