LAPLACE-FC

Laser Flip Chip Bonder

The LAPLACE-system provides an integrated solution for flip chip assembly. The laser assisted assembly is applied for soldering, ACF and NCP interconnections. The optional dispensing unit in the flip chip assembly platform allows a maximal flexibility for flux, solder paste and/or ACF, NCP dispense.

LAPLACE-FC (Product Brochure Download /.pdf 1MB)

Highlights
  • Flip chip placement, reflow & curing in one step
  • Fluxfree reflow with laser
  • No additional reflow or curing
  • Suitable for Flip Chip Soldering and adhesive Flip Chip: ACF, NCP, ICA
  • Substrate materials:
    • PI, PVC, PE, Polyester
    • Paper based low cost substrates and others
   
   
Applications
Options
Benefits
Technical Specifications