SB²-Jet

Laser Solder Jetting System

The SB²-Jet is the most advanced system for automated high-speed sequential solder-ball attach and laser reflow. The system is capable to singulate, to position and to reflow solder balls with a diameter between 40 µm and 760 µm.

SB² Systems (Product Brochure Download /.pdf 3MB)

Highlights
  • Solder Jetting
  • SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi
  • Flux-free reflow with laser
  • Solder ball diameter 40 – 760µm
  • In-line capability
  • Ball rework & (de-balling & re-balling) capability
Applications
Options
Benefits
Technical Specifications