SB²-M

The SB²-M is the smallest available equipment in the SB²-series with a maximum working area of 4”. It is a semiautomatic solder ball placement reflow/rework machine designed for small volume manufacturing, prototyping and research & development.

SB² Systems (Product Brochure Download /.pdf 3MB)

Highlights
  • Solder Jetting
  • SnAgCu, SnAg, SnPb, AuSn, InSn,  SnBi
  • Flux-free reflow with laser
  • Solder ball diameter 100 – 760µm
  • Ball rework & (de-balling & re-balling) capability
Applications
Options
Benefits
Technical Specifications