SB²-SM

Laser Solder Jetting System

The SB²-SM has a smaller footprint than the SB²-Jet and a maximum working area of 8”. In areas with limited floor space, or costly environmental aspects, using the SB²-SM has distinct advantages. The SB²-SM is sequential solder ball attach system that can operate either in a fully automatic mode or in a semiautomatic mode.

SB² Systems (Product Brochure Download /.pdf 3MB)

Highlights
  • Solder Jetting
  • SnAgCu, SnAg, SnPb, AuSn, InSn,  SnBi
  • Flux-free reflow with laser
  • Solder ball diameter 60 – 760µm 
  • In-line capability
  • Ball rework & (de-balling & re-balling) capability
   
   
Applications
Options
Benefits
Technical Specifications