SB²-SMs

Laser Solder Jetting System

The SB²-SMs is a compact machine for sequential solder ball attach/ solder jetting to a variety of different microelectronic substrates. The system is capable to singulate, to position and to reflow solder balls with a diameter between 100 µm and 760 µm. The machine has to drawer for loading and unloading the products.

SB² Systems (Product Brochure Download /.pdf 3MB)

Highlights
  • Solder Jetting
  • SnAgCu, SnAg, SnPb, AuSn, InSn,  SnBi
  • Flux-free reflow with laser
  • Solder ball diameter 100 – 760µm 
Applications
Options
Benefits
Technical Specifications