Automatic Ultra-SB² 200/300

Micro Ball Bumping for Flip Chip & Wafer Level CSP

Ultra-SB² (Product Brochure Download /.pdf 1MB)

Highlights
  • 60µm – 500µm solder spheres
  • Wafer sizes: 6”- 12”
  • 120µm – 1mm pad pitches
  • Solder bump height coplanarity: <10µm @ 3 sigma
  • Robot Handling from cassette to cassette
  • Flexible solder ball alloy compositions: g. SnAgCu, SnAg, AuSn, PbSn
  • up to 40 Wafers/hour (8’’) 25 Wafers/hour (12’’)
  • Low tooling cost
  • Volume production & prototyping capability
  • 100% pre balling wafer inspection and electronic wafer ink map update

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Technical Specifications