Semi-automatic Ultra-SB² 200

Solder Ball Transfer on wafer level

The Ultra-SB² 200 is a semiautomatic machine for one step solder ball placement on wafer level.

Ultra-SB² (Product Brochure Download /.pdf 1MB)

Highlights
  • 100µm – 760µm solder spheres
  • Wafer sizes: 6”, 8”

Applications
Technical Specifications