Wafer Level Reflow

PacTech provides two solutions for wafer level reflow processes.

The Automatic RFA 200/300 Reflow Oven offers low cost solder ball reflow on wafer level for wafer sizes 6”, 8” and 12”. The Semi-Automatic Reflow Oven RFM 200 systems are ideal for low cost solder ball reflow on wafer level for wafer sizes 4”- 8″.

Depending on the selected profile the throughput for both types of machines is approx. 20 wafers/hour.

RFA 200/300

PacTech / RFA 300 / web

 

Automatic Handling

more info

RFM 200/300

PacTech / RFM / web

 

Manual Handling

more info