RFA 200/300

Reflow Oven for Wafer Level Soldering

The  Reflow Oven RFA 300 systems are the ideal solution for low cost solder ball reflow on wafer level for wafer sizes 6”, 8” and 12″.

RFA 200/300 (Product Brochure Download /.pdf 2MB)

Highlights
  • Automatic system with wafer loading/unloading from cassette to cassette via robot handling
  • Volume production & prototyping capability 
  • Throughput: approx. 20 Wafers/hour (depends on selected profile)
  • Free adjustable time for pre delay for heating and cooling 
  • Temperature programmable up to 350°C
   
   
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Benefits
Technical Specifications