RFM 200/300

Semi Automatic Low Cost Reflow Oven

Reflow Oven for Wafer Level Soldering

The  Reflow Oven RFM 200 systems are the ideal solution for low cost solder ball reflow on wafer level for wafer sizes 4”- 8″.

RFM 200/300 (Product Brochure Download /.pdf 1MB)

Highlights
  • semiautomatic handling for wafer movement to heating plate
  • Free adjustable time for pre delay for heating and cooling
  • Temperature programmable up to 350°C
   
   
Applications
Benefits
Technical Specifications