Wafer Level UBM Plating

Pac Tech’s fully automatic electroless nickel plating line (PacLine™ Series 200 and 300) allows the processing of 100-300mm wafers with Ni, Pd and Au at volumes of 600,000 parts per year.

 

PacLine 300 A50

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PacLine 200 M25

PacTech / PacLine 200

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