Wafer Level UBM Plating

PacTech’s fully automatic electroless nickel plating line (PACLINE™ Series 200 and 300) allows the processing of 100-300mm wafers with Ni, Pd and Au at volumes of 600,000 parts per year.

 

PacLine 300 A50

more info

PacLine 200 M25

PacTech / PacLine 200

more info