PacLine 200 M25

Manual Equipment for Electroless Deposition of NiAu, NiPd and NiPdAu

PacLine 200 M25 – is a manual Bumping Line for processing wafers up to 8” with Al or Cu pad metallization.

The modular bumping line consists of a customized numberof process modules, 4 QDR’s and one dryer. The processing of the wafers is done by manual operator handling.

Pac Tech offers a turnkey solution by delivering the equipment and the process chemicals in combination with a technology transfer.

PacLine 200 M25 (Product Brochure Download /.pdf 2MB)

Highlights
  • Capability for parallel processing of 25 wafers up to 8”
  • Controller for each module (PLC only, no PC)
  • Notooling
   
   
Applications
Benefits
Technical Specifications