| |
|
|
|
Advanced Packaging Equipment
Wafer Level Packaging
e-Ni/Au Plating
Solder Bumping
Backend & Assembly |
|
 |
| |
|
|
PAC TECH provides state-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries. This equipment is divided into three separate platforms: e-Ni/Au Plating, Solder Bumping, and Backend Assembly.
The cornerstone to PAC TECH's equipment offering is the fully automatic electroless nickel plating line (PACLINE™ Series 200 and 300). This sytem allows for processing 100-300mm wafer with Ni, Pd, and Au at volumes of 600,000 parts per year. In addition, PAC TECH offers the peripheral equipment associated with electroless plating, including: plasma clean (PlasPac), resist and dielectric coating (SpinPac), megasonic solvent cleaning (MegaPac).
PAC TECH offers two different equipment platforms for depositing solder on top of the e-Ni/Au UBM. These include the Laser Assisted Solder Jetting (SB²) tools and the Solder Balling (Ultra-SB²) tools. The SB²-Jet is ideal for processing MEMS, Military, and Medical applications; as well as single die, probe cards, substrates, Hard Disc Drive heads and camera modules. The Wafer Level Solder Ball equipment is ideal for high yield and high volume bumping applications.
To facilitate a full turn key solution to their equipment line, PAC TECH offers a full set of additional equipment for Wafel Level Packaging and Backend appplications, including: laser based assembly tools LAPLACE™-FC, LAPLACE-CAP, LAPLACE-CAN, Laser Marking (LS²) and Reflow Oven.
|
