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2008 |
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Official Opening of PAC TECH Asia SDN. BHD in Penang, Malaysia
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The Sun - RM20mil facility in Penang for Pac Tech |
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Open Ceremony - Pac Tech Malaysia |
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New Device for Solder - Ball Bumping Disclosed in Patent |
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IMAPS Scottsdale - NiPdAu |
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Advanced Packaging - Solder Ball Transfer for flip Chip and WLCSP |
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RFP milestone granted for E-Less NiAu Bumping at NXP in Hamburg |
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Solder Bumping - ein neues, flexibles AVT-Verfahren für optoelektronische Systeme |
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Productronica 2007 - From Package to System |
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New Device for Solder-Ball Bumping Disclosed in Patent |
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10 Jahre Pac Tech in Nauen |
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Member Company Profil of Pac Tech |
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Pac Tech Opens New Asian Facility on Penang Island |
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Archiv
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2007
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New Packaging Technologies – Taking their time, but now things are moving - From Package to System
Productronica Daily 2007, pp. 28-29, Thomas Oppert, et. al.
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New Device for Solder-Ball Bumping Disclosed in Patent (7,121,449)
October 2007, Chip Scale Review, pp. 63, Jason Mirabito et. al.
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Mikrochips vom Schlangenhorst Vor zehn Jahren kam die Firma Pac Tech nach Nauen
June 2007, Jens Wegener.
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MEPTECH - Member Company Profile of Pac Tech
June 2007
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Pac Tech Opens New Asian Facility on Penang Island
January 2007
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2006
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Havelländer zieht es nach Malaysia
December 2006
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Nagase Acquires 60% Share of Pac Tech GmbH
February 2006
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2004
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Prime Minister Matthias Platzeck from Brandenburg Visits PacTech ( German Language )
January 2004
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2003
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PacTech and DEK Join Forces for High-Volume Wafer Bumping Solution
June 2003
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Pac Tech Obtains the Innovation Award of Havelland ( German language )
January 2003
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2002
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Pac Tech USA Inc. Accepts Orders for Electroless Ni/Au Bumping
October 2002
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PacTech USA Will Complete Construction of Its 2000 ft² Clean Room
September 2002
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2001
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Pac Tech Achieves ISO 9001 Registration for the Equipment Manufacturing Facility
September 2001
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PacTech Flip Chip Solder Ball Placement and Laser Reflow System to be Demonstrated at SEMICON West
July 2001
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Advanced PacLine A25 Installed at Alpha Bumping in Japan
February 2001
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2000
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Pac Tech GmbH Archives ISO 9001 Registration
October 2000
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1999
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Pac Tech Was Nominated for the INNOVATION SPREIS of Deutsche Bank
October 1999
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PacTech Opens U.S. Electroless Wafer Plating Facility; Establishes California Sales and Marketing Office
July 1999
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PacTech and AtoTech Form Alliance for Low Cost Flip Chip Bumping
May 1999
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Pac Tech Opens First European Subcontractor Bumping Facility
January 1999
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