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Solder Jetting & Solder Deballing and Reballing
SB²-Jet (Laser Solder Jetting System):
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The SB²-Jet solder balling system is the ideal solution for flexible solder ball placement and laser reflow.
At an average speed of 7 balls per second, it is one of the fastest machines on the market today. Different machine platforms are available, from small and midsize semiautomatic machines for prototyping and R&D to high volume (24/7) production machines with various possibilities of different handling systems. The machines provide a reproducible and reliable solder bumping technology for:
Wafers, Optoelectronic Devices, MEMS, Sensors, BGA's, CSP, cLCC's, QFN's, Flip Chips, HDD (HGA, HSA), Camera Modules and many more applications
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SB²-Jet
SB²-SM
SB²-M
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Specifications:
- Single-step solder ball placement and laser reflow
- Fluxfree reflow with laser
- No special tooling required
- No additional reflow required
- Solder ball diameter from 40µm up to 760µm
- Solder alloy flexibility:
Eutectic & high-lead SnPb
Leadfree SnAg, SnAgCu, AuSn, InSn, SnBi
- In-Line capability, robot cassette to cassette handling
- High throughput
- Accurate positioning system
- Solder Deballing & Reballing capability
- 2D Ball inspection system
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