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Solder Jetting & Rework
SB²-Jet (Laser Solder Ball Jetting System):
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The SB²-Jet solder ball system is the ideal solution for flexible solder ball placement and laser reflow.
At a maximum speed of 10 balls per second, it is one of the fastest machines on the market today. Different machine platforms are available, from semiautomatic machines for prototyping and R&D as well as high volume (24/7) production machines with various possibilities of different handling systems. It provides a reproducible solder bumping technology for the packaging of :
Wafers, Optoelectronic Devices, MEMS, Sensors, BGA's, CSP, Flip Chips, HDD (HGA, HSA), Camera Modules
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SB²-Jet
SB²-SM
SB²-M
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Specifications:
- Single-step solder ball placement and reflow
- Fluxfree reflow with laser
- No special tooling required
- No additional reflow required
- Solder ball diameter from 40µm up to 760µm
- Solder allay flexibility:
- Eutectic & high-lead SnPb
- Leadfree SnAg, SnAgCu, AuSn
- In-Line capability, robot cassette to cassette handling
- High throughput
- Accurate positioning system
- Ball rework & repair capability
- Ball inspection system
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