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RF Reflow Oven
RFM / RFA 200/300 (Solder Ball Reflow on Wafer Level):
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The RF Reflow Oven systems are the ideal solution for low cost solder ball reflow on wafer level for wafer sizes 6", 8" and 12".
Two systems are available: a semi-automatic cost-efficient system with manual wafer loading/unloading and small footprint (RFM 200/300), as well as an automatic system with wafer loading/unloading from cassette to cassette via robot handling (RFA 200/300).
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RFA 200/300
RFM 200/300
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Specifications:
• Wafer sizes: 6”, 8” and 12”
• Volume production & prototyping capability
• Stainless steel body mirror shining polished (RFM 200/300)
• Free adjustable time for pre delay for heating and cooling
• Temperature programmable up to 350°C
• Nitrogen regulator for flow control
• Reflow under inert – active gas
• Exhaust can be connected
• Inert gas consumption adjustable between 0 – 50l/ min
• Wafer cooling in inert gas
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