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What's new?
1) Turnkey Solutions for Laser 3D-Interconnect
- 3D soldering technology for camera module bonding
- Bypass diode assembly for solar cells
- Wafer- & substrate-level solder balling, deballing and reballing
2) Turnkey Solutions for Electroless Wafer/Substrate Plating
- Eless NiPd(Au) OPM for gold and copper wire bonding
- Eless NiAu for solar cells
SB<sup>2-Jet
Laplace-Soltec
Ultra-SB<sup>2
SB2-Jet
LAPLACE-HT
Ultra-SB2 300
 

 

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PAC TECH offers worldwide high volume, quick turn and prototyping
subcontracting services and advanced packaging equipment.
Subcontracting Services: Equipment Solutions:
bluedot Electroless Ni/Au under bump metallization
bluedot Electroless Ni/Pd/Au wire bond interface
bluedot Wafer backside metallization
bluedot Solder bumping for flip chip & wafer level CSP
bluedot Solder jetting & solder sphere placement
bluedot Wafer thinning
bluedot Backside laser marking
bluedot Dicing
bluedot Die sort to tape & reel, waffle pack, or gel pack
bluedot Flip chip and WLCSP assembly services
bluedot Electroless Ni plating line for wafers (PacLine)
bluedot Solder jetting equipment (SB2-Jet)
bluedot Solder sphere placement (Ultra-SB2 300)
bluedot BGA solder rework & repair (SB2-M)
bluedot Wafer level reballing (Ultra-SB2 300 WLR)
bluedot Spin coating equipment (SpinPac ASC 200/300)
bluedot Plasma cleaning (PlasPac)
bluedot Megasonic cleaning (MegaPac)
bluedot Laser assisted flip chip bonder (LAPLACE)
bluedot Solder reflow for wafers (RFM/RFA 200/300)
bluedot Customized equipment for solar industry
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For additional inquiries on this event or to request more product information
please visit our website
http://www.pactech.com or contact:
Mr. Thomas Oppert
Vice President Global Sales & Marketing
Tel: +49 3321 4495-620
E-mail:
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Mr. Lino Poosch
Sales & Marketing
Tel: +49 3321 4495-201
E-mail:
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Visit us at NEPCON China 2012, booth 1B110.
Feel free to contact us today and make an appointment to discuss your requests on site.
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