Backend & Assembly Services


In addition to the foundry services for Wafer Bumping Pac Tech:
 
 

 1.) supplies chemicals and materials for the equipment it sells

  Chemical and Materials  
     

 2.) provides onsite service and repairs

  Service and Repairs  
     

 3.) provides test wafers and boards

 Test Boards

 Test Wafers
     

 4.) provides analytical services

Analytical Services

 
     

 5.) provides Flip Chip assembly services

 Pac Tech offers the assembly of Flip Chips for prototyping and small volumes
 in cooperation with Smart Pac GmbH - Technology Services.

 These services include Laser-based assembly using the LAPLACE equipment.

 In addition Pac Tech offers following services:

- Laser Marking

- Wafer Thinning
  We are using the latest leading-edge machine from Disco, we can provide thinning to different
  wafer thicknesses down to 100µm on Si an GaAs devices. We provide a series of backgrinding
  finishes and roughness, including Grit# 1200, 2000 and Poligrind. Chemical stress relief is offered
  as an additional option.

- Wafer Dicing
  Pac Tech has a series of state-of-the.art double spindle machines for wafers from 4" to 12"
  diameter. We offer a series of tapes including UV Tape and Non-UV Tape. Our processes
  are highly controlled with optional AOI control of front side and back side chipping.

- Wafer Level RDL

- Tape & Reel
   Tape & Reel is a value-added service for our turnkey solution here in Pac Tech. The components
   are placed in specifically designed pockets embossed in a plastic carrier tape and it is sealed with
   the cover tape to keep the parts in the pockets.
 Smart Card Module
Smart Card Module		 [Keine Beschreibung eingegeben]
Consumer product with Flip Chip