• HOME
  • WLP SERVICES
    • Electroless Nickel Plating
    • Solder Bumping
    • Backend & Assembly
    • Chemistries & Materials
    • Flip Chip Test Wafer
      • Test Chip 2.0
      • Test Chip 2.1
      • Test Chip 2.3
      • Test Chip 2.5
      • Test Chip 2.6
  • EQUIPMENT
    • Solder Jetting & Rework
    • Wafer Level Balling
    • Wafer Level Rework
    • Electroless Nickel Plating
      • PACLINE e-Ni Plating Line
      • SPINPAC Spin Coater
      • PLASPAC Plasma Etch
      • MEGAPAC Megasonic Clean
    • Backend & Assembly
      • LAPLACE FC-Assembly
      • HS3 2D Inspection
      • LS2 Laser Marker
      • RFA 300 Reflow Oven
    • Photovoltaic
    • ATV Equipment
  • NEWS & EVENTS
    • Press Releases
    • Upcoming Exhibitions
  • DOWNLOADS
    • Product Brochures
    • Publications
    • Quality Certificates
  • CAREERS
    • Germany
    • United States
    • Asia
  • ABOUT US
    • Top-Management-Team
    • Society Memberships
  • CONTACT US
    • Global Sales
    • Equipment Services
 

Society Memberships

IMAPS

Corporate Member since 2007

SMTA
MEPTEC

Corporate Member of IMAPS since 2001

Thorsten Teutsch     - National Technical Committee (Flip Chip)

Andrew Strandjord     - National Technical Committee (WLCSP), Technical Chair Device Packaging Conference (WLCSP), Past VP of Technology and Council Member

IDEMA Member

Silicon Saxony

SEMI