For ultra fast 2-D Optical Inspection of solder bumped wafers up to 8" : Flip Chips, CSP, BGA

Specifications:

Speed:1.25 min for an 8" Wafer

Accuracy:5 µm

Ball diameter:50 µm to 1.5 mm solder

Measurements:
Ball size
Ball position
Ball pitch
Ball absence
Ball shape
Solder bridges
Misplaced ball

Optional automatic wafer loader