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HS3 2D Optical Inspection System:
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For ultra fast 2-D Optical Inspection of solder bumped wafers up to 8" : Flip Chips, CSP, BGA
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Specifications:
Speed:1.25 min for an 8" Wafer
Accuracy:5 µm
Ball diameter:50 µm to 1.5 mm solder
Measurements: Ball size Ball position Ball pitch Ball absence Ball shape Solder bridges Misplaced ball
Optional automatic wafer loader
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