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Global Locations
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PAC TECH GmbH
Am Schlangenhorst 15-17
14641 Nauen, Germany
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PAC TECH USA Inc.
328 Martin Avenue
Santa Clara, CA 95050, USA
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PAC TECH Asia Sdn. Bhd.
Plot 14, Medan Bayan Lepas
Technoplex, Phase 4
Bayan Lepas Industrial Zone
1190 Bayan Lepas, Penang, Malaysia |
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NAGASE & CO., Ltd.
5-1, Nihonbashi-Kobunacho,
Chuo-ku, Tokyo
103-8335 Japan
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How to get to |
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How to get to |
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Facility Size : 32918 m² (108000 ft²)
Production Size :10058 m² (33000ft²)
Cleanroom Size : 1676 m² (5500 ft²)
Class : 1,000 and 10,000
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Facility Size : 3050 m² (10000 ft²)
Cleanroom Size : 610 m² (2000 ft²)
Class: 10,000
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Facility Size : 5311 m² (57167 ft²)
Cleanroom Size : 1587 m² (5208 ft²)
Class: 1,000 and 10,000
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Product Offerings by Site
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PAC TECH - Europe
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PAC TECH - USA |
PAC TECH - Asia
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NAGASE Japan |
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Equipment Manufacturing and
Equipment Sales & Service
Solder Jetting & Rework: SB²-Jet, SB²-SM, SB²-M
Wafer Level Balling: Ultra-SB² 200/300
Wafer Level Rework: Ultra-SB² 300 WLR
Electroless Bumping Line: PacLine 200/300
Spin Coating: SpinPac ASC 150/200/300
Plasma- & Flux-Cleaning
Flip Chip-, Cantilever-, & Capacitor Bonding: LAPLACE-FC, LAPLACE-Can, & LAPLACE-Cap
2D Inspection
Laser Marking
Reflow Oven: RF 200/300
Photovoltaic
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Equipment Sales &
Service
Equipment Sales
Equipment Demo Center
Equipment Service
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Equipment Sales & Service
Equipment Sales
Equipment Demo Center
Equipment Service
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Equipment Sales & Service
Equipment Sales
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Bumping Services
Backend & Assembly Services
Electroless Ni/Au Bump
Solder Stencil Printing
Solder Ball Placement
Gang Ball Placement
Wafer Sawing & Scribing
Wafer Thinning/Backgrinding
Wafer Level RDL & CSP
FC-Assembly
Tape & Reel
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Bumping Services
Backend & Assembly Services
Laser Microassembly
Wafer Bumping Service
Electroless Ni/Au
Solder Stencil Printing
Solder Ball Placement
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Bumping Services
Backend & Assembly Services
Electroless Ni/Au Bump
Solder Stencil Printing
Solder Ball Placement
Gang Ball Placement
Wafer Sawing & Scribing
Wafer Thinning/Backgrinding
Wafer Level RDL & CSP
FC-Assembly
Tape & Reel
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Bumping Services
Electroless Ni/Au Bump
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