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PlasPac 300 Plasma Clean/Etch System:
| RIE System for Wafer Cleaning and Resist Ashing Processes in Volume |
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Specifications:
- 2.5 kW @ RF Frequency (500 W per Electrode)
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Wafer size
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Number of wafers
per cycle time
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Throughput
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4", 5", 6"
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25 wafers
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~ 75 wafers / hour*
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8"
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20 wafers
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~ 60 wafers / hour*
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8"
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20 wafers
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~ 40 wafers / hour**
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12"
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5 wafers
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~ 15 wafers / hour*
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* for Al pad cleaning
** for stripping of backside photo resist
- Maximum Flexibility: 4”, 5”, 6”, 8”, 12”
- Process Monitoring and Quality Data Base
- Flexible Recipe Management
- Size: 1200 x 1300 x 2200 mm (D x W x H)
- Main Power supply: 11,5 kW
- Vacuum Supply: pumping capacity 410 m3/h (50 Hz), Ultimate pressure 5E-3 mbar
- Vacuum chamber ID 850 x 850 x 850mm
- Gas supply: 2-4 mass flow controllers Cooling Unit: Total refrigerating capacity 6 kw
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SpinPac SC 200/300 Spin Coater:
Automated coating system for wafers up to 12“. The coater is equipped with two hotplates for wafer curing/baking at different temperatures.
The coating technology provides a very high quality and repeatability of the coating uniformity, especially for wafer backside resist and at the edges of wafers.
The max throughput for the automated system is 50 wafers per hour.
The Spin Coater is available as semi-automatic system with manual loading or fully automated system with cassette to cassette handling. |
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MEGAPAC MP 300 - Megasonic Clean with QDR and Wafer Handling System:
The Megasonic system MP 300 is e.g. suited for cleaning of flux residues from wafers after wafer level solder paste printing and solder paste reflow.
The system can handle a maximum of one wafer carrier with 25 wafers 8” or 13 wafers 12". |
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Specifications:
- Suitable for a Variety of Cleaning Processes:
e.g.: Solder Flux Cleaning
- Explosive Safe Construction
- Semi-Automatic PLC Control
- Additional QDR Rinse Tank
- Maximum Flexibility: 4”, 5”, 6”, 8”, 12”
- Size: 1200 x 800 x 1810 mm (D x W x H)
- Basin size: 370 x 370 mm
- AC 400 V, 50 Hz / 25 A / 5 kW
- Frequency: 1 MHz
- Heating power: 3 kW
- Circulation-Filtration: 15 l/min
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Electroless Nickel Plating
PacLine 200/300 (Automated Equipment for Electroless Deposition of NiAu and/or NiPdAu):
| The – PacLine 300 A50 – is fully automated equipment for electroless deposition of Ni/Au or NiPdAu bumps on semiconductor wafers with Al or Cu pad metallization. The system is able to process carriers with 50 wafers up to 8” and 26 wafers 12”.The PacLine contains of a complete software solution for recipe management, process control and data logging. Complex failure and emergency routines are providing a secure system operation for handling of up to 3 process carrier in parallel. The usage of SECS GEM communication protocol enables direct interfacing with the facility host and flexible final adjustment on customer requirements. Pac Tech is offering standard configured and industry proven bumping line’s as well as customized wet benches. The modular bumping line consists of an input/output station, a customized number of process modules, Quick Dump Rinse tanks, drying station and automatic Ni stripping. |
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cc 
Automatic PacLine 300 A50
PacLine 200 A50
Manual PacLine 200 MLC25
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Specifications:
- 4" - 12" full flexibility
- UPH: typ. 150 Wafers 8"/hour (5µm Ni/Au UBM)
- Thick Au ability for wire bonding reliability
- Controller for electroless Ni
- Semi conform HMI
- PLC controlled automatic handling
- Additional security tanks for each module
- SECS GEM Interface
- QualPac statistic and process control
- Stainless steel or PVDF frame/housing available
- Inline drying station
- The system fulfils the fire safety standard FM 4910
Benefits:
- Total Quality Software QualPac for ISO 9001
- Already installed at leading OEM production sites
- World wide support team located at
Nauen Germany
Silicon Valley USA
Penang Malaysia
Bangkok Thailand
- Turnkey process solution
- Equipment, Process Transfer, Chemistry
- Maximum Flexibility for 4”- 12” with no tooling
- Compliant with Semi S2 ; FM 4910 and CE
- Flexibility in customer specific requirements/adaptations
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