LAPLACE 200/300 Laser Assembly System:

The LAPLACE provides with a  speed of  3000  placements per hour a solution for BGA’s, Flip Chip attach underfill and reflow on Flex, Substrates  for LCD - Driver, Smart   card and smart label application


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LAPLACE 300

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LAPLACE Reel to Reel

Specifications:

  • Flip chip placement & reflow, curing in one step
  • Fluxfree reflow with laser
  • No additional reflow, curing
  • Suitable for Flip Chip Soldering and adhesive Flipchip:
  • ACE, NCP, ICA
  • Substrate materials:
  • PI, PVC, PE, Polyester, paperbased low cost substrates
  • In-Line capability
  • High throughput
  • Available with different accuracy specs [±2,5µm, ±5µm, ±10µm, ±25µm]
  • Vision system
  • Temperature control unit
  • Reel to reel unit (optional)
  • Waferhandling systems (optional)
  • Laser class I (IEC825, E DIN VDE 0750, 871, 837, CDRH)
 

LS² Backside Laser Marking System:

The LS² - systems are used for laser marking of silicon wafers in wafer level packaging. LS² allows marking of product logos, cell codes and fond sets for product identification and traceability.

The unique feature of LS² is the integrated quality control QualMark. It allows the control of quality during wafer marking as an online process control with fast response to production and it eliminates the additional post process production and optical inspection.

 


The Wafer marking System LS² is available in a fully automatic production compatible version with automatic cassette wafer handling. It can handle wafer sizes of 4, 6, 8 and 12 inch.

Additional a semiautomatic tool LS²-SM for low volume production, prototyping and development is available.
Backside Wafer Marking System

LS Laser Marker Specifications:

min. 10µs/pixel, can be increased in steps of 10µs

Accuracy and Repeatability in x/y-axis: Up to 5 µm

Pixel Diameter: 40 µm/pixel

 

 

Speed:

 

min. 10µs/pixel, can be increased in steps of 10µs

 

Accuracy and Repeatability in x/y-axis: Up to 5 µm

 

Pixel Diameter: 40 µm/pixel <span style="font-size:

 

 

coming soon

 
 

HS3 2D Optical Inspection System:

For ultra fast 2-D Optical Inspection of solder bumped wafers up to 8" : Flip Chips, CSP, BGA

Specifications:

Speed:1.25 min for an 8" Wafer

Accuracy:5 µm

Ball diameter:50 µm to 1.5 mm solder

Measurements:
 Ball size
Ball position
Ball pitch
Ball absence
Ball shape
Solder bridges
Misplaced ball

Optional automatic wafer loader