PacTech – Packaging Technologies and SiChuan SiChip Microelectronics announce the establishment of a partnership in China, with the main objective to introduce low cost high reliability electroless plating, and other wafer level packaging technologies into China.

In the first phase of the collaboration roadmap, the company will setup an electroless plating line, (Pacline 300 A50) in SiChip, with annual capacity of more than 500,000 wafers per year (200mm equivalent). Simultaneously, the company will transfer the NiAu electroless plating technology for solder bumping, solder clip attach and high reliability wirebonding, targeting 4”-8” wafer processing for discrete devices. The plating line is capable to handle up to 12” wafers and will utilize PacTech’s newest cyanide-free chemistry product line.

Phase Two includes technology transfer of solder bumping and backside metallization processes to provide more comprehensive services in wafer level packaging, especially for WLCSP and MOSFET applications. The solder bumping process will be done by PacTech’s very own Gang Ball Placement technology (Ultra-SB2), which can process solder balls as small as 60um diameter and up to 1 million bumps per wafer.

PacTech Group CEO, Dr. Thorsten Teutsch is excited about the cooperation, commenting that “on top of the technology transfer, the company will also work with SiChip on application development, including solder jetting applications with PacTech’s laser jetting technology (SB2-Jet), to enable application support in China and provide value-added services to existing customers worldwide!”

SiChip, a company founded by veterans from the semiconductor and electronics industry in China, believes that this cooperation will provide a unique cost competitive alternative for the domestic China market in semiconductor discrete devices and integrated circuits manufacturing industry.

PacTech News: PacTech and SiChip Launch Partnership in China