LAPLACE-HT

Fully Automated Bonder for High Throughput Laser Soldering

The LAPLACE-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules. The automatic machine punches and forms lead frames, dispenses solder paste and performs diode laser attach to the lead frame. A final electrical and visual test is done on the assembled modules and chip packages within the machine.

Highlights
  • Reel-to-reel cutting system for metal lead frame
  • Pick and place unit for punched metal parts and assembled parts
  • High speed paste dispense
  • Diode pick up from die feeder
    • Laser soldering
    • Electrical test
    • Optical test

Applications
Technical Specifications