PacTech’s Wafer Level Packaging

Pac Tech’s Electroless Nickel Technology is recognized throughout the industry as the highest quality process with the widest product flexibility. These technologies include: Ni/Au and Ni/Pd for Under-Bump-Metallization, tall Ni/Au for ACF and ACA bumping, and Ni/Au and Ni/Pd/Au for pad re-metallization (OPM for wirebonding).

Pac Tech offers several technologies for solder deposition including

Single sphere solder jetting using PacTech’s SB² Laser based Bumping tools, and complete wafer bumping using PacTech’s Ultra-SB² Solder Sphere Transfer equipment. The combination of these technologies allows PacTech to provide the widest product offering in the industry; servicing the ASIC, Foundry, Military, Medical, Aerospace, Consumer, Telecommunication, Memory, MEMS, Probe Card, and Hard Disc Drive industries.

To facilitate being a full service provider, Pac Tech offers a complete set of additional wafer level and backend services, including: sawing, dicing, redistribution, repassivation, backside laser marking, backside coating, test die, and assembly.

In addition, Pac Tech owns the latest metrology and analytical equipment to help in the development and production processes, including: x-ray, shear test, AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc

Wafer Level Bumping (Flip Chip and WLCSP)
Wafer Level Backend Processing and Assembly
Solder Jetting & Deballing / Reballing