SB² Technologies – for flexible solder ball placement and laser reflow

Solder Sphere Jetting (SB²) Wafer Level Solder Balling (Ultra-SB²) Solder Deballing/Rework
Product Types
Prototype Wafers
Low I/O Count Wafers
Low Volume Wafers for Medical
Low Volume Wafers for Military
Low Volume ASIC Wafers
Probe Cards
MEMS
Hard Disc Drives
Camera Modules
3D Packaging
BGA, CSP, cLCC etc.
High Volume Wafer Level Solder Bumping

 

High I/O Applications

 

High yield applicatins


BGA
cLCC
CSP
etc.

Solder Bump Height 40 – 760um 60 – 760 um 150 – 760um
Smallest Bump Pitch 80um 80um 200um
Throughput 7 balls/second 25-30 wafers/hr 1 ball/sec

 

Process Flow

Solder Sphere Jetting (SB²)

 

Wafer Level Solder Balling (Ultra-SB²)

 

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Jet Solder and Reflow

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Turn on Vacuum and Pick Up Solder Spheres

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Remove Wafer / Substrate

 

 

Align Head to Pre-Fluxed Wafer

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Lower Sphere onto Wafer

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Release Vacuum and Raise Head

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Reflow