Flip Chip Test Wafer Pac 2.6

Wafer specifications

  • 6“ silicon wafer
    – other substrates / semiconductor materials
    – on request (e.g. glass, GaAs)

General data

chip no chip size / mm pitch / µm pad configuration I/O’s chips per wafer
 1  10,0 x 10,0 225 peripheral  160 48
2 300 area 1022 48
3 250 peripheral 144 43

Bump specifications

Available with following bump types

  • Electroless Ni/Au (5μm, 10μm, 15μm and 25μm)
    for ACF, NCP and ICA adhesive Flip Chip attach
  • Solder bumps
    – SnPb 63/37, SnAg4Cu0,5
    – other alloys on request (e.g. PbSn 90/10, AuSn 80/20)

Electrical measurements

  • Daisy Chain Structures
  • Four Point Kelvin Structures

Download design rules geometrical data FC Test Wafer Pac 2.6

PAC-TECH-Test-Chip-2-6 (.pdf/ 1.3MB)