Product Types

High Volume Wafer Level Solder Bumping

High I/O Applications

High yield applicatins

Solder Bump Height 60 – 760 um
Smallest Bump Pitch 80um
Throughput 25-30 wafers/hr

 

Process Flow

Wafer Level Solder Balling (Ultra-SB²)
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Turn on Vacuum and Pick Up Solder Spheres

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Align Head to Pre-Fluxed Wafer

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Lower Sphere onto Wafer

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Release Vacuum and Raise Head

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