Pac Tech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and highest quality.
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Employees in Europe, USA and Asia
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Mio.€ • Annual sales turn over PacTech Group
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Production Machines in the field
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Manufacturing Facilities
History:
Senior Management

Annette Burczyk
Managing Director / CFO
PacTech Group

Dr. Thorsten Teutsch
Managing Director / CEO
PacTech Group

Dipl.-Ing. Thomas Oppert
Vice President
Global Sales & Marketing

Thorsten Krause
Business Unit Manager
Equipment
PacTech GmbH

Matthias Fettke
Business Unit Manager
Service & Application
PacTech GmbH

Ricardo Geelhaar
Business Unit Manager
Wafer Level Packaging
PacTech GmbH
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