Pac Tech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and highest quality.

0
Employees in Europe, USA and Asia
0
Mio.€ • Annual sales turn over PacTech Group
0+
Production Machines in the field
0
Manufacturing Facilities

History:

  • 1995: Founded in Berlin, Germany as spin-off from Fraunhofer-IZM
  • 1997: 1st Manufacturing facility: Pac Tech GmbH, Nauen, Germany
  • 2001: 2nd Manufacturing facility: Pac Tech USA Inc., CA, USA
  • 2005: Equipment Field Service & Support Center, Thailand
  • 2008: 3rd Manufacturing facility: Pac Tech Asia Sdn. Bhd., Malaysia
  • 2013: > 115 patents granted
  • 2014: Demo Center Opening: Hsinchu, Taiwan
  • 2015: Demo Center Opening: Shanghai, China
  • 2015: 100% owned by NAGASE & Co. Ltd.
  • 2017: 1200th Production Machines shipped

 

 

Senior Management

Annette Burczyk
Managing Director / CFO
PacTech Group

Dr. Thorsten Teutsch
Managing Director / CEO
PacTech Group

thomasoppertvicepresidentpactech

Dipl.-Ing. Thomas Oppert
Vice President
Global Sales & Marketing

Thorsten Krause Division Manager Production Equipment PacTech Group
Thorsten Krause
Division Manager
Production Equipment
PacTech GmbH
Lars Titerle Division Manager Development Equipment PacTech Group

Lars Titerle
Division Manager
Development Equipment
PacTech GmbH

Matthias Fettke Division Manager Service & Application PacTech Group
Matthias Fettke
Division Manager
Service & Application
PacTech GmbH
Ricardo Geelhaar Division Manager Wafer Level Bumping & Packaging PacTech Group
Ricardo Geelhaar
Division Manager
Wafer Level Bumping & Packaging
PacTech GmbH

 

Society Memberships

Society Memberships