Pac Tech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment. As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also provides state-of-the-art worldwide contract services for low-cost wafer level bumping and packaging at competitive prices and highest quality.

0
Employees in Europe, USA and Asia
0
Mio.€ • Annual sales turn over PacTech Group
0+
Production Machines in the field
0
Manufacturing Facilities

History:

  • 1995: Founded in Berlin, Germany as spin-off from Fraunhofer-IZM
  • 1997: 1st Manufacturing facility: Pac Tech GmbH, Nauen, Germany
  • 2001: 2nd Manufacturing facility: Pac Tech USA Inc., CA, USA
  • 2005: Equipment Field Service & Support Center, Thailand
  • 2008: 3rd Manufacturing facility: Pac Tech Asia Sdn. Bhd., Malaysia
  • 2013: > 115 patents granted
  • 2014: Demo Center Opening: Hsinchu, Taiwan
  • 2015: Demo Center Opening: Shanghai, China
  • 2015: 100% owned by NAGASE & Co. Ltd.
  • 2018: 1300th Production Machines shipped

 

 


Senior Management

Annette Burczyk
Managing Director / CFO
PacTech Group

Dr. Thorsten Teutsch
Managing Director / CEO
PacTech Group

thomasoppertvicepresidentpactech

Dipl.-Ing. Thomas Oppert
Vice President
Global Sales & Marketing

Thorsten Krause Division Manager Production Equipment PacTech Group
Thorsten Krause
Business Unit Manager
Equipment
PacTech GmbH

Matthias Fettke Division Manager Service & Application PacTech Group

Matthias Fettke
Business Unit Manager
Service & Application
PacTech GmbH

Ricardo Geelhaar Division Manager Wafer Level Bumping & Packaging PacTech Group
Ricardo Geelhaar
Business Unit Manager
Wafer Level Packaging
PacTech GmbH

 

Society Memberships

Society Memberships