During Semicon Taiwan 2012 Pac Tech will demo their new SB²-Jet for Solder Ball Attach and Repair. The modular system can place and laser reflow solder spheres down to 30µm on wafers and substrates.

The SB²-Jet is a flexible machine platform for automatic Solder Ball Rework with Ball Inspection and Ball Placement on a max. 500mm […]