Thomas Oppert, Vice President Global Sales & Marketing, talks about the technology innovations at PacTech and the developments we can expect from the company in the future.
Pac Techs SB² platform is developed for fast prototyping and rework/reballing on wafer, substrate and package level.
The new SB² -Jet has an option for slim, stacked solder column attach and laser reflow. The machine handles high temperature – high Pb, low temperature InSn, SnBi and standard SAC solder alloys with ball Diameters from 760 […]
During Semicon Taiwan 2012 Pac Tech will demo their new SB²-Jet for Solder Ball Attach and Repair. The modular system can place and laser reflow solder spheres down to 30µm on wafers and substrates.
The SB²-Jet is a flexible machine platform for automatic Solder Ball Rework with Ball Inspection and Ball Placement on a max. 500mm […]