2012

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    Pac Tech presents SB² Column Stack Equipment at IMAPS San Diego

Pac Tech presents SB² Column Stack Equipment at IMAPS San Diego

Pac Techs SB² platform is developed for fast prototyping and rework/reballing on wafer, substrate and package level.

The new SB² -Jet has an option for slim, stacked solder column attach and laser reflow. The machine handles high temperature – high Pb, low temperature InSn, SnBi and standard SAC solder alloys with ball Diameters from 760 […]

September 4th, 2012|
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    PAC TECH opens Taiwan Application Center for Solder Ball and Jet Platform

PAC TECH opens Taiwan Application Center for Solder Ball and Jet Platform

During Semicon Taiwan 2012 Pac Tech will demo their new SB²-Jet for Solder Ball Attach and Repair. The modular system can place and laser reflow solder spheres down to 30µm on wafers and substrates.

The SB²-Jet is a flexible machine platform for automatic Solder Ball Rework with Ball Inspection and Ball Placement on a max. 500mm […]

August 23rd, 2012|
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