DOWNLOADS
CAREERS
ABOUT US
CONTACT US
SALES
CUSTOMER SERVICE
LANGUAGE
HOME
EQUIPMENT
General Overview
Wafer Level UBM Plating
Solder Jetting
Solder Ball Transfer
Solder Ball Rework
Laser Bonding
Wafer Reflow
Spin Coating
Wafer / Substrate Cleaning
Photovoltaic
WLP SERVICES
General Overview – WLP
Solder Bumping
Wafer Level Redistribution
Flip Chip Test Wafer
Test Wafer Pac 2.0
Test Wafer Pac 2.3
Test Wafer Pac 2.7
Wafer Level Photoresist / BCB Coating
Wafer Level UBM Plating
Electroless Plating
Electroplating
Wafer Backside Metallization
Bonding / Assembly
Wafer Thinning
Wafer Sawing
Die Sort
CHEMISTRY
Portfolio
Analysis Methods
Development Roadmap
NEWS & EVENTS
Press Releases
Exhibitions
News Overview
HOME
EQUIPMENT
General Overview
Wafer Level UBM Plating
Solder Jetting
Solder Ball Transfer
Solder Ball Rework
Laser Bonding
Wafer Reflow
Spin Coating
Wafer / Substrate Cleaning
Photovoltaic
WLP SERVICES
General Overview – WLP
Solder Bumping
Wafer Level Redistribution
Flip Chip Test Wafer
Test Wafer Pac 2.0
Test Wafer Pac 2.3
Test Wafer Pac 2.7
Wafer Level Photoresist / BCB Coating
Wafer Level UBM Plating
Electroless Plating
Electroplating
Wafer Backside Metallization
Bonding / Assembly
Wafer Thinning
Wafer Sawing
Die Sort
CHEMISTRY
Portfolio
Analysis Methods
Development Roadmap
NEWS & EVENTS
Press Releases
Exhibitions
News Overview
Company Brochures
Home
Downloads
Company Brochures
Company Brochures
Georg Reinecke
Our Services and Products at a glance
Wafer Level Bumping & Packaging Services
Wafer Level Packaging
SB² for Specialty Substrates
Advanced Packaging Equipment
Solder Jetting & Laser Bonding
Ultra-SB² 200/300
Ultra-SB² 300 WLR
PacLine 200/300 A50
SpinPac ASC 200/300
PlasPac 200
MegaPac 300 plus
Reflow Oven RFM 200/300
Reflow Oven RFA 200/300
Please contact us for more details!
Name *
Email *
Phone *
Subject
Comments
We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.
Ok
Read more
