Our Publications
Publications 2020
M. Fettke, T. Kubsch, Vinith Bejugam, A. Frick, A. Kolbasow, A. Walter and Dr. T. Teutsch
“Facile interconnect formations involving SB²-Jet solder ball stacking and colonnade patterning in hybrid package architectures”
A. Kolbasow, M. Fettke, T. Kubsch, Vinith Bejugam and Dr. T. Teutsch
“Study of solder interconnect configurations & performance of vertical laser assited assembled “3.5D” packages”
M. Fettke, A. Kolbasow, V. Bejugam, T. Kubsch, A. Frisck and Dr. T. Teutsch
“A study on laser-assited bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs”
M. Fettke, T. Kubsch, A. Kolbasow, V. Bejugam, A. Frick and Dr. T. Teutsch
“Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die ship packages”
Publications 2019
Keith R. Berry Jr., Ricardo L. Romo, Megan Mitchell, Vinith Bejugam and D. Keith Roper
“Controlled Gold Nanoparticle Placement into Patterned Polydimethylsiloxane Thin Films via Directed Self-Assembly”
A. Kolbasow, T. Kubsch, M. Fettke, G. Friedrich and Dr. T. Teutsch
“Vertical laser assisted bonding for advanced “3.5D” chip packaging”
M. Fettke, A. Kolbasow, G. Friedrich, A. Palys, V. Bejugam and Dr. T. Teutsch
“SB²-WB: A new process solution for advanced wire-bonding”
Publications 2017
M. H. Azhdast, M. Kossatz, H. J. Eichler, K.-D. Lang and V. Glaw
“Deposition of Al and Cu nanoparticles on Silicon Wafer using a Picosecond Nd: YAG Laser: An Experiment-based Parameter Optimization Guide”
M. H. Azhdast, M.Kossatz, H. J. Eichler, K.-D. Lang and V. Glaw
“Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from Aluminum and Copper on Silicon wafer substrate”
Publications 2016
“Progress in Wafer Level Bumping, Flip Chip Assembly and Electromigration Performance in Flip Chip Lead-Free Solder Connections with 30µm or 40µm Diameter”
BIT’s 6th Annual World Congress of Nano Science & Technology, (Singapore), Oct. 26-28, 2016
Thorsten Teutsch, Thomas Oppert, Andrej Kolbasow
“Advanced Laser Bonding of Ultra Fine Pitch Cantilever Spring Pins for Assembly of Flash, DRAM and Logic Probe Cards”
Semiconductor Wafer Test Workshop, (San Diego, California), June 5-8, 2016
Publications 2014
“Advanced Technologies and Equipment for 3D-Packaging”
Semicon Russia Conference, (Moscow, Russia), May. 14-15, 2014
Publications 2013
Thomas Oppert
“Micro Ball Bumping for Wafer Level & 3-Dimensional Applications using Solder Sphere Transfer and Solder Jetting”
Semicon Russia, June 6, 2013
Thorsten Teutsch, Elke Zakel, Thomas Oppert, Ghassem Azdasht
“Eless NiPd and NiPdAu OPM: A Low Cost, High Throughput Solution for Enhanced Gold and Copper Wire Bond Reliability”
IMAPS Workshop on Wire Bonding, (San Jose, California), Jan. 22-23, 2013
Publications 2012
„Micro Ball Bumping Packaging For Wafer Level & 3-D Solder Spehere Transfer and Solder Jetting”
IEMT 2012 (Ipoh, Malaysia), Nov. 6 -9
Thomas Oppert, Andrew Strandjord, Thorsten Teutsch, Ghassem Azdasht, Elke Zakel
„Methods of Micro Ball Bumping for Wafer Level & 3-Dimensional Application using Solder Sphere Transfer and Solder Jetting”
Pan Pacific 2012 (Kauai, Hawaii), Feb. 14 – 16
Publications 2011
„Wafer Level Bumping and Flip Chip Assembly with Solder Balls Down to 30µm”
IMAPS 2011 (Longbeach, USA), Oct 9-13.2011
Jörg Franke, Rainer Dohle, Florian Schüßler, Thomas Oppert, Thomas Friedrich and Stefan Härter
„Processing and Reliability Analysis of Flip-Chips with Solder Bumps Down to 30 µm Diameter”
ECTC 2011 (Florida, USA), Jun 01-02.2011
Andrew Strandjord, Jing Li, Axel Scheffler and Thorsten Teutsch
„WLCSP and FlipChip Production Bumping Using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies”
Apex Conference (Santa Clara, USA), Apr. 12-14.2011
Publications 2010
„Wafer Level Packaging of Compound Semiconductors”
IWLPC 2010 (Santa Clara, USA), Oct. 13-14.2010
Rainer Dohle, Florian Schüßler, Thomas Friedrich, Jörg Goßler, Thomas Oppert, Jörg Franke
„Adapted Assembly Processes for Flip-Chip Technology With Solder Bumps of 50µm or 40µm Diameter”
ESTC 2010 (Germany, Berlin),Sep 13-16.2010
Andrew Strandjord, Thorsten Teutsch, Thomas Oppert, Ghassem Azdasht
„Wafer-Level Solder Sphere Placement and its Implications”
Global SMT & Packaging Magazine – Celebrating 10 Years -, 07.2010, p. 14 – 25
Thorsten Teutsch
„Repair, Rework, and Reball Solder Ball”
US Tech, 07.2010
Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Bernd Otto, Jing Li
„Low Cost Wafer Bumping of GaAs Wafers”
IMAPS Device Packaging Conference, (Scottsdale, Arizona), Mar. 8-11, 2010
Elke Zakel
„WLCSP and Flipchip production using electroless Ni/ Au plating and Wafer Level Solder Sphere Transfer Technologies”
Microtech 2010 (Cambridge, UK), 03.2010
Publications 2009
„Wafer Bumping im Fokus”
Magazin Productronic 11-2009, p. 84-86
Andrew Strandjord, Thorsten Teutsch, Ghassem Azdasht
„Laser Based Assembly of Ultra FinePitch Bumped ICs for Chip-tochip Proximity Coupled application”
IMAPS Symposium, (USA, San Diego), Nov. 3-5. 2009
Florian Schüßler, Rainer Dohle, Thomas Oppert, Ghassem Azdasht, Georgi Georgiev, Jörg Franke
„New Solder Bumping Technology and Adapted Assembly Processes for 100 ?m Pitch Flip-Chip-Technology Using Capillary Flow or No Flow Underfill”
SMTA, (Orlando, Florida), Oct. 4-8, 2009
Andrew Strandjord, Axel Scheffler, Elke Zakel, Thomas Oppert, Thorsten Teutsch
„Electroless Nickel/Gold Under-Bump-Metallization Cost Comparison”
IMAPS Device Packaging Conference, (Shanghai, China), Mar. 19-20, 2009
Andrew Strandjord, Thorsten Teutsch,Jing Li, Thomas Oppert, Elke Zakel
„Ultra Fine Pitch Bumping Using e-Ni/Au and Sn Lift-Off Processes”
IMAPS Device Packaging Conference, (Scottsdale, Arizona), Mar. 10-12, 2009
Publications 2008
„Bumping for WLCSP using Solder Ball Attach on electroless NiAu UBM”
arcsis Micropackaging Days, Gardanne, France), Dec 4-5, 2008
Thomas Oppert, Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Ghassem Azdasht, Elke Zakel
„WLCSP and Flip Chip Bumping Technologies”
International Electronic Manufacturing Technoligy Conference, (Penang, Malaysia), Nov 4-6, 2008
Andrew Strandjord, Axel Scheffler, Bernd Otto, Thorsten Teutsch, Thomas Oppert, Elke Zakel
„WLCSP Solder Bumping Mechanical Reliability Testing”
IMAPS International Symposium, (Province, Rhode Island), Nov 2-6, 2008
Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Thomas Oppert, Ghassem Azdasht, Elke Zakel
„WLCSP Production using electroless NiAu Plating and Wafer Level Solder Spere transfer Technology”
International Wafer-Lever Packaging Conference, (San Jose, California), Oct 15-16, 2008
Thomas Oppert, Thorsten Teutsch, Ghassem Azdasht, Elke Zakel
„Bumping for WLCSP using micro solder ball attach on electroless NiAu & NiPdAu UBM”
Advanced Packaging Confernce, (Stuttgart, Germany), Oct 8-9, 2008
Thomas Oppert, Thorsten Teutsch, Elke Zakel
„Lead-free WLCSP Solder Bumps on ENIG & ENEP(G) UBM – a Comparision of Intermetallic Properties using High Speed Pull Test”
IMAPS Nordic, (Helsingoer, Denmark), Sep. 16-16, 2008
Thorsten Teutsch
„ENIG vs. ENEP (G) Under Bump Metallization for Lead free WL-CSPSolder Bumps – a Comparison of Intermetallic Properties Using High Speed Pull Test”
IMAPSInternational Conference on Device Packaging, (Scottsdale, Arizona), Mar. 17-20, 2008
Publications 2007
„Solder Bumping-ein neues flexibles AVT-Verfahren für optoelektronische Systeme”
Jahresbericht Fraunhofer IOF, S.83-89, 2007
Thomas Oppert, Elke Zakel, Thorsten Teutsch
„Wafer Level Packaging & Bumping – New achievements on technical feasibility and reliability by using an electroless Ni/ Au UBM”
Arcsis Micropackaging Days, (Gardanne, France), Nov 29-30, 2007
Thomas Oppert
„Wafer Level Packaging & Bumping – A view from a European Service Provider”
9th International IEEE CPMT Symposium on High Density Design, Packaging and Microsystem Integration (HDP´07), (Shanghai, China), Jun. 26-28, 2007
Thomas Oppert
„(Micro) Ball Placement for Wafer Level CSP”
Deutsches IMAPS Seminar 2007 (Illmenau, Germany), Feb. 8, 2007
Publications 2006
„Laser assisted Soldering and Flip Chip Attach for 3-D Packaging”
31st International Conference on Electronics Manufacturing and Technology – IEMT 2006 (Kuala Lumpur, Malaysia), Nov. 8-10, 2006
Thomas Oppert, Elke Zakel, Thorsten Teutsch
„Wafer Bumping & Wafer Level Packaging for 300mm Wafer”
31st International Conference on Electronics Manufacturing and Technology – IEMT 2006 (Kuala Lumpur, Malaysia), Nov. 8-10, 2006
Elke Zakel, Thomas Oppert
„Wafer Bumping & Wafer Level Packaging for the European Market”
International Microelectronic and Packaging Society Conference – IMAPS Nordic 2006 (Gothenburg, Sweden), sep. 18-19, 2006
Thorsten Teutsch, Elke Zakel, Ghassem Azdasht
„Pulsed-laser Heating for Flip Chip Assembly”
Advanced Packaging, pp. 40-43, Pennwell Corp., May/June 2006
Thomas Oppert, Thorsten Teutsch, Elke Zakel
„300mm-Electroless Bumping”
Internepcon 2006 (Tokyo, Japan), Jan. 18-20, 2006
Thomas Oppert, Elke Zakel
„Wafer Bumping – State of the art technology; Requirements & developments from the perspective of a European Wafer Bumping Service Provider”
Materials Valley e.V. – Roadmap for Wafer Bumping Workshop (Hanau, Germany), Feb. 23-24, 2006
Publications 2005
„Low Cost Bumping for RFID Chips”
Proceedings of the Low-Cost RFID IC Packaging and Assembly Workshop (Munich, Germany), Nov. 14, 2005
Thomas Oppert
„Development of a European Low Cost Bumping Technology & Service”
Proceedings of the Microtech 2005 (Cambridge, United Kingdom), Mar. 01-02, 2005
Thomas Oppert, Thorsten Teutsch, Elke Zakel
„300mm-Electroless Bumping”
Internepcon 2005 (Tokyo, Japan), Jan. 19-21, 2005
Publications 2004
„A Performance Driven Bumping Solution for Automotive Power Electronics”
Proceedings of the International Microelectronic And Packaging Society (Long Beach, California), Nov. 14-18, 2004
Elke Zakel, Thomas Oppert, Thorsten Teutsch
„Lead Free Solder Bumping for Flip Chip and Wafer Level CSP”
Proceedings of the Workshop on Flip Chip Technology in a lead-free Environment (Milano, Italy), June 22, 2004
Thorsten Teutsch, Thomas Oppert, Elke Zakel, Mervi Paulasto-Kröckel
„Low Cost Wafer Bumping for Power Electronics Device Interconnection”
Proceedings of the Flip Chip Technology Workshop (Austin, Texas), June 21-24, 2004
Thomas Oppert, Elke Zakel, Thorsten Teutsch
„How to grow a Flip Chip Bumping Service Business”
Proceedings of the Global Business Council Summer Conference (Austin, Texas), June 21, 2004
Thorsten Teutsch
„Society for Experimental Mechanics, 5th International Symposium on MEMS and Nanotechnology”
7-10 June 2004, Costa Mesa, California
Thomas Oppert, Ghassem Azdasht, Elke Zakel
„Laser assisted Wafer Level Packaging for MEMS”
Elke Zakel, Thomas Oppert, Ghassem Azdasht, Thorsten Teutsch
„Low Cost Electroless Bumping for Ultra Fine Pitch Applications in 8″ and 12″ Wafers”
Thorsten Teutsch, Ronald G. Blankenhom, Elke Zakel
„Lead-Free Solder Bumping for High Temperature Automotive Application”
Thorsten Teutsch, Ronald G. Blankenhom, Ghassem Azdasht, P.Penke, Elke Zakel
„LAPLACE – A New Assembly Method using Laser Heating for Ultra Fine Pitch Devices”
Elke Zakel, Thorsten Teutsch, Ron Blankenhorn
„Process Makes Electroless Nickel/Gold Wafer Bumping Economical for Flip-Chip Packaging”
Publications 2003
IMAPS Advanced Technology Workshop on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications
Baltimore, Maryland March 12 – 14, 2003
Elke Zakel, Thomas Teutsch, Ghassem Azdasht, P.Penke
„A New Low Stress and Flexible Assembly Method using Laser Heating for NCP, ACF and Solder Interconnection”
Thomas Teutsch, Elke Zakel, Ronald G. Blankenhorn
„Fluxless Laser Solder Jetting for Optoelectronics and MEMS Packaging”
Elke Zakel, Ghassem Azdasht, Thorsten Teutsch, Ronald G. Blankenhorn
„Laser Assisted Flip Chip Assembly for LCD Applications using ACP and NCP Adhesive Joining”
Elke Zakel, Thorsten Teutsch
„Advanced Flip Chip Technology and It´s Application in Europe”
Elke Zakel, Thorsten Teutsch, Ron Blankenhorn
„Cost-Effective 300mm Electroless Wafer Bumping”
Elke Zakel, Thorsten Teutsch, G. Frieb, Ghassem Azdasht, Jürgen Kurz
„Laser Solder Jetting in Advanced Packaging”
Thomas Oppert, L Titerle, Elke Zakel, Ghassem Azdasht, Thorsten Teutsch
„Placement and reflow of solder balls for FC, BGA, Wafer-Level-CSP, Optoelectronic Components and MEMS by using a new solder jetting method”
Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn
„Laser Solder Attach for Optoelectronics Packages”
Thomas Oppert
„IMAPS Flip Chip Technology Workshop 2002, Contactless Laser Solder Jetting for fine pitch flip chip bumps”
Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn
„Laser Solder Ball Application for Optoelectronics and MEMS Packaging”
Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn
„High Speed Laser Solder Jetting Technology for Optoelectronics and MEMS Packaging”
Ron Blankenhorn, Thomas Oppert
„A Semi-Additive Electroless Ni-Au Process Offers a Low-Cost Wafer-Bumping Method”
Publications 2001
Low Cost Bumping Technology based on Electroless Ni and Solder Paste
Area Array Interconnection Handbook, pp. 76-88, Kluwer Academic Publishers, 2001, ISBN 0-7923-7919-5
Thomas Oppert
„Wafer Bumping und Flip Chip Technik – Miniaturisierungsmäglichkeiten für die drahtlose Kommunikation”
Thomas Oppert, Thorsten Teutsch, Elke Zakel
„Low Cost Flip Chip Bumping”
Thomas Oppert
Wafer Bumping und Flip Chip Technik – Miniaturisierungsmöglichkeiten für die drahtlose Kommunikation
Innovationsforum Drahtlose Kommunikation (Frankfurt/Oder, Germany), Apr. 10, 2001
Thomas Oppert, Thorsten Teutsch, Elke Zakel
„A Wafer Level CSP based on a Low Cost Electroless Redistribution Layer”
Thomas Oppert, Thorsten Teutsch, Elke Zakel, Ghassem Azdasht
„Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP”
Thorsten Teutsch, Thomas Oppert, Elke Zakel, Eckart Klusmann, Heinrich Meyer, Ralf Schulz, Jörg Schulze
„Wafer Level CSP using Low Cost Electroless Redistribution Layer”
Thorsten Teutsch, Thomas Oppert, Elke Zakel, Eckart Klusmann, Heinrich Meyer, Ralf Schulz, Jörg Schulze
„Wafer Level CSP using Low Cost Electroless Redistribution Layer”
Thomas Oppert, Thorsten Teutsch, Elke Zakel
„Low Cost Bumping on Wagerlevel for 300mm Wafer”
Publications 1999
„A Low Cost Bumping Process for 300mm Wafers”
Proceedings of the International Microelectronic and Packaging Society (Chicago, Illinois), Oct 26-28, 1999
Thomas Oppert, Thorsten Teutsch, Elke Zakel, David Tovar
„A Bumping Process for 12″ Wafers”
Publications 1998
„Solder Ball Bumper SB²-A flexible Manufacturing Toll for 3-dimensional Sensor and Microsystem Packages”
Proceedings of the 22nd International Electronics Manufacturing Technology Symposium (Berlin, Germany), Apr. 27-29, 1998
Thomas Oppert, Thorsten Teutsch, Elke Zakel
„A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au”
E. Zakel, T. Oppert, P. Kasulke, L. Titerle
„F²-cPAC – A manufacturing Process for a Low Cost CSP”
Multi Chip Module Conference (Denver, Colorado), Apr., 1998
T. Oppert, E. Zakel, T. Teutsch
„A Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging Using Electroless Nickel Gold Bumping”
Flip Chip Workshop (Braselton, Georgia), March, 1998
E. Zakel, T. Oppert, P. Kasulke, L. Titerle
„F²-cPAC – A manufacturing Line for a Flex-Based CSP”
Proceedings of the 3rd International Conference on Chip Scale Packaging (Sunnyvale, California), Feb. 12-13, 1998
Publications 1997
„The FPC Laser Bonder – A modular system for Chip on Flex Production”
Proceedings of the 3rd International Assembly and Packaging foundry Conference (Sunnyvale, California), Sept. 25-26,1997
P. Kasulke, T. Oppert, E. Zakel, G. Azdasht
„FlexPAC – A manufacturing process for a low cost CSP”
Proceedings of the 4th International Conference on Flex Circuits (Sunnyvale, California), Sept. 22-24, 1997
P. Kasulke, E. Jung, T. Oppert, K.-F. Becker, E. Zakel, H. Reichl
„High Precision Torsion Tester for Flip Chip, CSP and BGA”
Proceedings of the International Flip Chip, Ball Grid Array, TAB and Advanced Packaging
Symposium (Sunnyvale, California), pp. 119-122, Feb. 18-19, 1997