LAPLACE-Cap
Georg Reinecke
LAPLACE-Cap
High Accuracy Automatic Laser Bonder for Capacitor Bonding
Capacitor Bonding and Laser Reflow for High Density Applications with Very Fine Component to Component Distances on Special Substrates like e.g. Wafer Probe Cards
LAPLACE-Cap
(Product Brochure Download)
- Placement accuracy: +/- ≤ 25µm
- Throughput: 500 capacitors per hour (including soldering)
- No additional reflow process needed
- Requires only a thin layer of solder on the substrate/component pad
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Capacitor Placement
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Capacitors
Wafer Probe Cards
others
SECS GEM Interface
integration in existing FAB software/hardware infrastructure
Capacitor feeder
Pick and place tool with 1µm resolution
Max. capacitor size: 1.25mm x 2.0mm (upgradable to max.: 2.5mm x 2.5mm)
Heating system with temperature controlling (Max. temp.: 150°C, temp. range: +/- 3°C)
Patented laser thermode tool
Bonding direction is 180°
Max. working area: 325mm x 325mm
Mechanical Data |
Dimensions L x W x H |
approx. 1520 mm x 1100 mm x 1890 mm |
Weight: |
about 1800 kg |
Noise: |
max. 80dB |
Electrical Data |
Voltage: |
AC 230 V +/-5%, 1 phase |
Max. Current: |
6 kVa |
Frequency: |
60 Hz |
Power consumption: |
Max. 6kW |
Ancillary Supply |
Air Pressure: |
400 kPa (4 kgf/cm³) |
Air flow rate: |
150 l/min |
Vision System – Die Detection Unit |
Specs for particular component |
Bonding accuracy: |
≤ ± 25µm |
Cycle time: |
12 sec per capacitor (without inspection) |
Force: |
0.1/1kg (manual adjustable) |
Capacitor size: |
1 x 0.5 x 0.5mm |
Capacitor supply form: |
Tape/roll |
Substrate weight: |
max. 20kg |
Substrate thickness: |
max. 50mm |
Size of substrate: |
max. 310mm⌀ |
z-axis: |
Travel range max. 50mm |
Interconnect method: |
Laser |
Fiducial marks: |
There are no fiducial marks on the substrate (Alignment will be done on any defined structure) |
Environmental Conditions |
Temperature : |
22 +/- 2 °C |
Relative Humidity: |
45% to 65%, Non Condensing |
Frequency: |
12 h |
Cleanroom Recommendation: |
Class 10.000 |