LAPLACE-FC
Georg Reinecke
LAPLACE-FC
Laser Flip Chip Bonder
The LAPLACE-system provides an integrated solution for flip chip assembly. The laser assisted assembly is applied for soldering, ACF and NCP interconnections. The optional dispensing unit in the flip chip assembly platform allows a maximal flexibility for flux, solder paste and/or ACF, NCP dispense.
LAPLACE-FC
(Product Brochure Download /.pdf 1MB)
- Flip chip placement, reflow & curing in one step
- Fluxfree reflow with laser
- No additional reflow or curing
- Suitable for Flip Chip Soldering and adhesive Flip Chip: ACF, NCP, ICA
- Substrate materials:
- PI, PVC, PE, Polyester
- Paper based low cost substrates and others
Flip Chip Assembly
Flip Chip on Flex
Flip Chip on PCB
Flip Chip on Wafer
Smart Cards
Smart Label products
LCD-Drivers
Vertical Chip bonding
Wafer Handling Systems
Reel to Reel Unit
Dispenser System
In-Line capability
High throughput
Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
Vision system
Temperature control unit
Laser class 1
| Mechanical Data |
| Dimensions L x W x H: |
approx. 1200 mm x 100 mm x 1670 mm |
| Weight: |
about 1800 kg |
| Noise: |
max. 80dB |
| Electrical Data |
| Line Voltage: |
230 V; 1 Phase, 1 Neutral, 1 Ground |
| Max. Current: |
20 A |
| Frequency: |
50/60 Hz |
| Power consumption: |
max. 6kW |
| Ancillary Supply |
| Air Pressure: |
min. 5 bar (72 PSI); max. 7 bar (101 PSI) |
| Air Flow Rate: |
150 l/min |
| Air Tube Diameter: |
6/8 mm (ID/OD) |
| Nitrogen Pressure: |
min. 3 bar; max. 12 bar |
| Nitrogen Rate*): |
max. 0,75 l/min |
| Nitrogen Tube Diameter: |
6/8 mm (ID/OD) |
| Laser Unit |
| Laser SP 120: |
Power 120W; CW Diode Laser |
| Other Specs |
| Bonding accuracy: |
+/-25µm (standard); +/-5µm, +/-10µm (optional) |
| Force: |
0.1/10kg (programmable) |
| Cleenroom class: |
10.000 |
| Substrate thickness: |
50µm to 500µm |
| Min. chip size: |
300µm x300µm (smaller on request) |
