LAPLACE-VC
Georg Reinecke
LAPLACE-VC
High Accuracy Automatic Laser Bonder for Vertical Chip Bonding
The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage.
The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate.
- In-Line capability
- High throughput
- Rotation correction and automatic alignment
Vertical Chip Bonding
Wafer Handling Systems
Dispenser System
Substrate Feeder
Direct Die Feeder
UV Curing
In-Line capability
High throughput
Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
Vision system
Rotation correction and automatic alignment
90 degree flip unit to present Die to the bonding tool
Temperature control unit
Laser class 1 certified tool
| Mechanical Data |
| Dimensions L x W x H |
approx. 1500 mm x 1200 mm x 2200 mm |
| Additional Clearance: |
back & sides: 500mm, front: 1000mm |
| Weight: |
about 1800 kg |
| Noise: |
max. 80dB |
| Electrical Data |
| Line Voltage: |
230 V; 1 Phase, 1 Neutral, 1 Ground |
| Max. Current: |
25 A |
| Frequency: |
60 Hz |
| Power consumption: |
max. 6kW |
| Ancillary Supply |
| Air Pressure: |
6 bar |
| Air Flow Rate: |
450 l/min |
| Air Tube Diameter: |
6/8 mm (ID/OD) |
| Nitrogen Pressure: |
min. 2 bar; max. 4 bar |
| Nitrogen Rate*): |
max. 2 l/min |
| Nitrogen Tube Diameter: |
6/8 mm (ID/OD) |
| Standard vacuum ejector is on board to create the vacuum, this requires compressed air. Optional for substrate handling can integrate Vacuum port to allow usage from the facility. |
| Laser Unit |
| Laser SP 120: Power 120W; CW Diode Laser ( object of change based on the process requirements) |
| Vision System – Die Detection Unit |
| Detection mode: |
Gray scale vision system |
| Camera: |
½ inch CCD Camera |
| Other Specs |
| Bonding accuracy: |
+/-25µm (standard); +/-5µm, +/-10µm (optional) |
| Force: |
0.1/10kg (programmable) |
| Chips supply form: |
Waffle/Gel pack |
| Cleanroom class: |
10.000 |
| Substrate thickness: |
50µm to 500µm |
