LaPlace – CPT
Laser Bonding System (LAB) with Compression Bonding and Laser Assisted Reflow.
SB² – USP
Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.
SB² – Jet
SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.
SB² – Compact
SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
Ultra – SB²
Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.
PacLine
The PacLine 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.
LaPlace – Can
Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.
LaPlace – HT
The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.
LaPlace – VC
The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.
SB² – WB
SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.
LaPlace – FC
The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.
SB² – SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
SB² – SM
The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.
