High Accuracy Automatic Laser Bonder for Vertical Chip Bonding

The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage.

The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate.

LAPLACE-VC (Product Brochure Download)

  • In-Line capability
  • High throughput
  • Rotation correction and automatic alignment
Technical Specifications

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