SB²-M
Georg Reinecke
SB²-M
The SB²-M is the smallest available equipment in the SB²-series with a maximum working area of 4”. It is a semiautomatic solder ball placement reflow/rework machine designed for small volume manufacturing, prototyping and research & development.
SB² Systems
(Product Brochure Download /.pdf 3MB)
- Solder Jetting
- SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi
- Flux-free reflow with laser
- Solder ball diameter 100 – 760µm
- Ball rework & (de-balling & re-balling) capability
Wafer Level
Wafer Level CSP
Single Chip
BGA / cLCC Balling
Rework/Repair of BGA-like packages
PCB
MEMS & 3D-Packaging
Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-motor)
Camera Modules
CMOS Sensors
Optoelectronics/Microoptics
Filter Devices (SAW, BAW, F-BAR)
Solder Ball Rework Station
Pattern Recognition and Fiducial Alignment
Heated chuck/work stage
Specific heated work holder for BGA-like devices
Automatic Z-height measurement
Single-step solder ball placement and laser reflow
No tooling (mask, stencil)
No flux
No mechanical stress/contact
No thermal stress
No cleaning of flux residues
No additional reflow
High Solder alloy flexibility
| Mechanical Data |
| Dimensions L x W x H |
approx. 752 mm x 700 mm x 1819mm |
| Ball Placement Rate |
Ball Placement & Reflow (standard-mode): 3 balls/sec
Solder Jetting (Jet-mode): up to 5 balls/sec (depending on ball size) |
| Working area |
| Working Area : 100 mm x 100 mm |
