SB²-SM
Georg Reinecke
SB²-SM
Laser Solder Jetting System
The SB²-SM has a smaller footprint than the SB²-Jet and a maximum working area of 8”. In areas with limited floor space, or costly environmental aspects, using the SB²-SM has distinct advantages. The SB²-SM is sequential solder ball attach system that can operate either in a fully automatic mode or in a semiautomatic mode.
SB² Systems
(Product Brochure Download /.pdf 3MB)
- Solder Jetting
- SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi
- Flux-free reflow with laser
- Solder ball diameter 60 – 760µm
- In-line capability
- Ball rework & (de-balling & re-balling) capability
Wafer Level
Wafer Level CSP
Single Chip
BGA / cLCC Balling
Rework/Repair of BGA-like packages
PCB
MEMS & 3D-Packaging
Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-motor)
Camera Modules
CMOS Sensors
Optoelectronics/Microoptics
Filter Devices (SAW, BAW, F-BAR)
Solder Ball Rework Station
Pattern Recognition and Fiducial Alignment
Upgrade to 6” working area
Upgrade to 8” working area
Heated chuck/work stage
Specific heated work holder for BGA-like devices
Automatic Z-height measurement
Single-step solder ball placement and laser reflow
No tooling (mask, stencil)
No flux
No mechanical stress/contact
No thermal stress
No cleaning of flux residues
No additional reflow
High Solder alloy flexibility
High throughput
| Mechanical Data |
| Dimensions L x W x H |
approx. 1183 mm x 800 mm x 1893mm |
| Ball Placement Rate |
| Up to 5 balls/sec (depending on ball size and application) |
| Working area |
Working Area : 100 mm x 100 mm (4”)
Optional : 150 mm x 150mm (6”) or 200 mm x 200 mm (8”) |
