Laser Solder Jetting System

The SB²-Compact is the newest addition to our industry-leading SB² laser soldering equipment family. It combines the advantages of our revolutionary SB² laser soldering technology with a highly flexible, ultra-compact workstation perfectly suited for economic budgets and lowest cost of ownership. The SB²-Compact represents the entry point for high-volume automated sequential laser soldering, catering to a variety of different microelectronic devices, especially dedicated for camera modules, sensors, and optical devices. It can be flexibly integrated into any manufacturing line by utilizing different selectable customized handling systems, such as a single-drawer system, an inline-conveyor-system or an automatic cassette loading system. It’s plug-and-play design allows future upgrades of the customized handling system in the field. The system is capable to singulate, to position and to reflow solder balls with a diameter between 250 µm and 760 µm with a soldering speed of 6-8 balls per second. It’s available in different color-ways at customer’s choice.

SB² Systems (Product Brochure Download)

  • 2D and 3D solder jetting
  • SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi
  • Flux-free reflow with laser
  • Solder ball diameter 250 – 760µm 
Technical Specifications

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