Gang Ball Placement for Wafer & Sustrate Level
Wafer Level Solder Balling is one of PacTech’s equipment platforms for solder deposition, covered by the Ultra-SB² machines. The Ultra-SB² is ideal for high yield and high volume wafer level solder balling applications.
Of the two machines available, the Automatic Ultra SB2 200/300 is made for micro ball bumping for flip chip & wafer-level CSP, whereas the Semiautomatic Ultra SB2-200 is used for one-step solder ball placement on wafer level.
Automatic Ultra-SB² 200/300
Micro Ball Bumping for Flip Chip & Wafer Level CSP
Semi-automatic Ultra-SB² 200
Solder Ball Transfer on wafer level