Automatic Ultra-SB² 200/300
Micro Ball Bumping for Flip Chip & Wafer Level CSP
Ultra-SB² (Product Brochure Download /.pdf 1MB)Highlights
- 60µm – 500µm solder spheres
- Wafer sizes: 6”- 12”
- 120µm – 1mm pad pitches
- Robot Handling from cassette to cassette
- Flexible solder ball alloy compositions: g. SnAgCu, SnAg, AuSn, PbSn
- up to 40 Wafers/hour (8’’) 25 Wafers/hour (12’’)
- Low tooling cost
- Volume production & prototyping capability
- 100% pre balling wafer inspection and electronic wafer ink map update
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Solder Balls, 80µm SnAgCu -
Applications
Wafer Level Chip Size Packages (CSP)
Wafer Level Flip Chip
others
Wafer Level Flip Chip
others
Options
Integrated flux printing unit
Integrated rework capability for yield improvement
2-D post balling inspection
Integrated rework capability for yield improvement
2-D post balling inspection
Technical Specifications
| Mechanical Data | |
|---|---|
| Dimensions L x W x H | approx. 2240 mm x 1790 mm x 2015mm |
| Weight: | approx. 2000 kg |
| Electrical Data | |
|---|---|
| Line Voltage: | 230 V; 1 Phase, 1 Neutral, 1 Ground |
| Max. Current: | 30 A |
| Frequency: | 50/60 Hz |
| Grounding: | Separate grounding connector |
| Ancillary Supply | |
|---|---|
| Vacuum Pressure: | approx. 0,03 bar (absolute) |
| Vacuum Flow Rate*): | n/a |
| Vacuum Tube Diameter: | 6/8 mm (ID/OD) |
| Air Pressure: | min. 5 bar (72 PSI); max. 7 bar (101 PSI) |
| Air Flow Rate: | max. 2500 l/min |
| Air Tube Diameter: | 16 mm (ID) |
| Nitrogen Pressure: | min. 2 bar (29 PSI); max. 3 bar (43 PSI) |
| Nitrogen Rate*): | max. 0,75 l/min |
| Nitrogen Tube Diameter: | 6/8 mm (ID/OD) |
Optional a vacuum ejector can be ordered to create the vacuum, this requires compressed air.
*) Required flow rate during operation.
| Environmental Conditions | |
|---|---|
| Operating Temperature : | 20 +/- 5 °C |
| Relative Humidity: | 30% to 80%, Non Condensing |
| Climatisation Time before 1st power on: | 12 h |
| Cleanroom Recommendation: | Class 10.000 or better |