Semi-automatic Ultra-SB² 200
Georg Reinecke
Semi-automatic Ultra-SB² 200
Solder Ball Transfer on wafer level
The Ultra-SB² 200 is a semiautomatic machine for one step solder ball placement on wafer level.
Ultra-SB²
(Product Brochure Download /.pdf 1MB)
- 100µm – 760µm solder spheres
- Wafer sizes: 6”, 8”
-
400,000 I/O’s, 80µm SnAgCu
-
Solder Balls, 80µm SnAgCu
Wafer Level Chip Size Packages (CSP)
Wafer Level Flip Chip
others
| Mechanical Data |
| Dimensions L x W x H |
approx. 1200 mm x 1200 mm x 1800mm |
| Weight: |
approx. 1200 kg |
| Electrical Data |
| Line Voltage: |
230 V; 1 Phase, 1 Neutral, 1 Ground |
| Max. Current: |
20 A |
| Frequency: |
50/60 Hz |
| Grounding: |
Separate grounding connector |
| Ancillary Supply |
| Vacuum Pressure: |
approx. 0,03 bar (absolute) |
| Vacuum Flow Rate*): |
n/a |
| Vacuum Tube Diameter: |
6/8 mm (ID/OD) |
| Air Pressure: |
min. 5 bar (72 PSI); max. 7 bar (101 PSI) |
| Air Flow Rate*): |
max. 2500 l/min |
| Air Tube Diameter: |
16 mm (ID) |
| Nitrogen Pressure: |
min. 2 bar (29 PSI); max. 3 bar (43 PSI) |
| Nitrogen Rate*): |
max. 0,75 l/min |
| Nitrogen Tube Diameter: |
6/8 mm (ID/OD) |
|
Optional a vacuum ejector can be ordered to create the vacuum, this requires compressed air.
*) Required flow rate during operation. |
| Environmental Conditions |
| Operating Temperature : |
20 +/- 5 °C |
| Frequency: |
12 h |
| Cleanroom Recommendation: |
Class 10.000 or better |
