Semi-automatic Ultra-SB² 200

The Ultra-SB² 200 is a semiautomatic machine for one step solder ball placement on wafer level.

Mechanical Data
Dimensions L x W x H	approx. 1200 mm x 1200 mm x 1800mm
Weight:	approx. 1200 kg

Electrical Data
Line Voltage:	230 V; 1 Phase, 1 Neutral, 1 Ground
Max. Current:	20 A
Frequency:	50/60 Hz
Grounding:	Separate grounding connector

Ancillary Supply
Vacuum Pressure:	approx. 0,03 bar (absolute)
Vacuum Flow Rate^*):	n/a
Vacuum Tube Diameter:	6/8 mm (ID/OD)
Air Pressure:	min. 5 bar (72 PSI); max. 7 bar (101 PSI)
Air Flow Rate^*):	max. 2500 l/min
Air Tube Diameter:	16 mm (ID)
Nitrogen Pressure:	min. 2 bar (29 PSI); max. 3 bar (43 PSI)
Nitrogen Rate^*):	max. 0,75 l/min
Nitrogen Tube Diameter:	6/8 mm (ID/OD)
Optional a vacuum ejector can be ordered to create the vacuum, this requires compressed air. ^*) Required flow rate during operation.