Hot Plate Wafer Reflow
Due to low consumption of Nitrogen PacTech provides two low cost solutions for wafer level reflow processes.
The Automatic RFA 200/300 Reflow Oven offers solder ball reflow on wafer level for wafer sizes 6”, 8” and 12”. The Semi-Automatic Reflow Oven RFM 200 systems are ideal for solder ball reflow on wafer level for wafer sizes 4”- 8″.
Depending on the selected profile the throughput for both types of machines is approx. 20 wafers/hour.