Hot Plate Wafer Reflow

Due to low consumption of Nitrogen PacTech provides two low cost solutions for wafer level reflow processes.

The Automatic RFA 200/300 Reflow Oven offers solder ball reflow on wafer level for wafer sizes 6”, 8” and 12”. The Semi-Automatic Reflow Oven RFM 200/300 systems are ideal for solder ball reflow on wafer level for wafer sizes 4”- 12″.

RFA 200/300

PacTech / RFA 300 / web

 

Automatic Handling

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RFM 200/300

PacTech / RFM / web

 

Manual Handling

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