The Reflow Oven RFA 300 systems are the ideal solution for low cost solder ball reflow on wafer level for wafer sizes 6”, 8” and 12″.
Sealed nitrogen reflow chamber
Fully automatic loading/unloading of wafers from cassette to cassette
Chuck/Hotplate for wafers up to 12”
Aluminum coated chuck/hotplate
Freely adjustable time for pre delay for heating and cooling
Temperature freely adjustable/programmable up to 350˚C
Chuck temperature homogenous less +/- 5°C by 250°C
Up to 4 programmable heating steps by adjusting height from wafer to chuck/hotplate
Programmable cooling time for Nitrogen flow cooling phase
Cooling rate parameter setting by time and flow for nitrogen (after 1min N2 flow > 100°C)
Nitrogen regulator for flow control
Vacuum detection for wafer
Handling mechanism for placing the wafer onto the heating plate (loading/unloading)
Reflow under Nitrogen atmosphere and lower than 50ppm oxygen
Exhaust can be connected to exhaust system
Chamber can be exhausted by using over flow nitrogen
Possible to suck the chamber down to 500mbar
Low nitrogen consumption due to small chamber
3 programs available:
- Pre-heating
- Reflow
- Cooling with Nitrogen gas
