Ultra-SB² 300 WLR
Equipment to improve solder ball attach yield to 100%
Ultra-SB² 300 WLR (Product Brochure Download /.pdf 2MB)Highlights
- Cassette to Cassette robot handling for wafer up to 12″
- Integrated 2-D AOI (missing ball, double ball, ball shape etc.)
- Integrated rework capability for yield improvement (single ball placement, single ball removal)
- UPH 8″~25 wafer/hour
- UPH 12″ ~15 wafer/hour
- Removal misplaced balls
- Reballing of missing balls
- Update of electronic wafer map
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400,000 I/O’s, 80µm SnAgCu -
Wafer Repair
Applications
Wafer Level Chip Size Packages (CSP)
Wafer Level Flip Chip
others
Wafer Level Flip Chip
others
Options
Flux Dispensing
Selective laser reflow
2-D post ball inspection
Selective laser reflow
2-D post ball inspection
Technical Specifications
| Mechanical Data | |
|---|---|
| Dimensions L x W x H | approx. 1860 mm x 1230 mm x 1570 mm |
| Weight | approx. 1200 kg |
| Electrical Data | |
|---|---|
| Line Voltage: | 230 V; 1 Phase, 1 Neutral, 1 Ground |
| Max. Current: | 20 A |
| Frequency: | 50/60 Hz |
| Grounding: | Separate grounding connector |
| Ancillary Supply | |
|---|---|
| Vacuum Pressure: | approx. 0,03 bar (absolute) |
| Vacuum Flow Rate*): | n/a |
| Vacuum Tube Diameter: | 8 mm (ID) |
| Air Pressure: | min. 5 bar (72 PSI); max. 7 bar (101 PSI) |
| Air Flow Rate: | max. 500 l/min |
| Air Tube Diameter: | 8 mm (ID) |
| Nitrogen Pressure: | min. 2 bar (29 PSI); max. 3 bar (43 PSI) |
| Nitrogen Rate*): | max. 0,75 l/min |
| Nitrogen Tube Diameter: | 6/8 mm (ID/OD) |
Optional a vacuum ejector can be ordered to create the vacuum, this requires compressed air.
*) Required flow rate during operation.
| Environmental Conditions | |
|---|---|
| Operating Temperature : | 20 +/- 5 °C |
| Relative Humidity: | 30% to 80%, Non Condensing |
| Frequency: | 12 h |
| Cleanroom Recommendation: | Class 10.000 or better |