Ultra-SB² 300 WLR

Equipment to improve solder ball attach yield to 100%

Ultra-SB² 300 WLR (Product Brochure Download)

  • Cassette to Cassette robot handling for wafer up to 12″
  • Integrated 2-D AOI (missing ball, double ball, ball shape etc.)
  • Integrated rework capability for yield improvement (single ball placement, single ball removal)
  • UPH 8″~25 wafer/hour
  • UPH 12″ ~15 wafer/hour
  • Removal misplaced balls
  • Reballing of missing balls
  • Update of electronic wafer map

Technical Specifications

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